In my never-ending quest for lower temps for my computer, I came up with the idea of adding very fine (0-1 micron) diamond dust to my thermal compound
arcitic silver 5 to increase its thermal transfer abilities. I understand that the particulate nature of the diamond would normally hinder its thermal conductivity, but if the particles of diamond are smaller than the particles of AS5, would the diamond mixture have a better thermal conductivity than pure AS5?
Just for background - a thermal compound is just something placed between a CPU core and a heatsink to increase the connected surface area.