Hi, i'm Michele,
I'm new here and my english it's not very good, but the lenguage of chemistry is universal and easy to understand.
I need to find a legant that allows to stabilizer cupros ion Cu(I) in a copper (II) suplphate/ sulphuric acid solution in present of oxygen bubbling, pH about 0.
It's note that the simplest way, one of this legants may be chloride or bromide anion, but my reactor sistem is made in steel AISI 304: under my reaction condition, chlorine and probably bromide will do a bad work on steel because in present of oxigen the rate of corrosion wiil be high, and my plant is not happy for this!
Another legant in my mind may be gluconate anion, but at pH 0 problably the ammount of associated (RCOOH) gluconic acid is very high and this fact is not good because the concentration of Cu(I) compound is inevitably low.
So, i'd like to ask you some idea to resolve my problem.
Can you help me?
Michele