[trankhanh_cr]

Hi everyone, I'm learning about copper technology in electronic circuit boards, someone could give me a document on this issue are not. Why copper atoms could be linked to the surface of the material, its link here is.
Thank you for reading.

[Borek]

I am afraid what you posted doesn't make much sense. Are you using an automatic translator? If so, it has failed.

I would start googling for "laminating pcb with copper".

[Enthalpy]

Neither am I sure to understand the question.

I've found no definitive information source. I suppose that the copper foils are laminated on the partly cured glass+epoxy composite ("prepreg"), and final curing of the epoxy glues the copper. Though, it seems that much work has been done to improve the adherence of the copper clad, so I can't exclude that an additional glue layer is used.

A manufacturer's website suggests that the copper film is initially thicker, and gets thinned (to 35µm or 70µm for instance) after it holds on the glass+expoxy.

[trankhanh_cr]

Sorry, i am going rewrite it.
I am finding document for making CCL (copper clad laminate) by Electrodeposition....
Thanks....

[DrCMS]

You might also want to look up the use of photoresists and etching.

[Hunter2]

Sorry, i am going rewrite it.
I am finding document for making CCL (copper clad laminate) by Electrodeposition....
Thanks....

Copperclad material is manufactured by electrodepositing on Stainless steel coils.
https://www.rogerscorp.com/documents/749/acs/Copper-Foils-for-High-Frequency-Circuit-Materials.pdf

[Enthalpy]

The same linked Pdf also cites lamination as a method to produce the copper foil from a billet. No idea which one is more common. Some patents indicate that the rough electrodeposited copper absorbs better the IR light from a laser used to pattern the copper, but this must be a marginal concern.

Whatever the method to obtain a copper film, it must adhere on the epoxy somehow.